发明名称 |
Method and apparatus for image sensor packaging |
摘要 |
Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be formed in a bond pad area of a BSI sensor where the bond pad array comprises a plurality of bond pads electrically interconnected, wherein each bond pad of the bond pad array is of a small size which can reduce the dishing effect of a big bond pad. The plurality of bond pads of a bond pad array may be interconnected at the same layer of the pad or at a different metal layer. The BSI sensor may be bonded to an ASIC in a face-to-face fashion where the bond pad arrays are aligned and bonded together. |
申请公布号 |
US8710607(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201213547269 |
申请日期 |
2012.07.12 |
申请人 |
CHEN SZU-YING;WANG TZU-JUI;YAUNG DUN-NIAN;LIU JEN-CHENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN SZU-YING;WANG TZU-JUI;YAUNG DUN-NIAN;LIU JEN-CHENG |
分类号 |
H01L31/18;H01L27/146;H01L31/02 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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