发明名称 |
Stacked structure and stacked method for three-dimensional chip |
摘要 |
A stacked structure and a stacked method for a three-dimensional integrated circuit are provided. The provided stacked method includes separating a logic chip into a function chip and an I/O chip; stacking the function chip above the I/O chip; and stacking at least one memory chip between the function chip and the I/O chip. |
申请公布号 |
US8710676(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US20110986184 |
申请日期 |
2011.01.07 |
申请人 |
CHOU YUNG-FA;KWAI DING-MING;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHOU YUNG-FA;KWAI DING-MING |
分类号 |
H01L25/16;H01L21/50 |
主分类号 |
H01L25/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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