Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages

摘要

A method of forming an integrated circuit (IC) package is disclosed comprising: (a) removing oxides from side surfaces of terminals of the IC package; (b) substantially covering an underside of the terminals of the IC package; and (c) forming a solder coating on the side surfaces of terminals of the IC packages while covering the underside of the terminals of the IC package. The solder coating on the side surfaces of the terminals protects the terminals from oxidation due to aging and subsequent processes. Additionally, the solder coating on the side surfaces of the terminals substantially improves the solderability of the IC package to printed circuit boards (PCBs) or other mountings. This further facilitates the inspection of the solder attachment using less expensive and complicated methods.