发明名称 |
Electronic device package and fabrication method thereof |
摘要 |
An electronic device package is disclosed. The package includes at least one semiconductor chip having a first surface and a second surface opposite thereto, in which at least one redistribution layer is disposed on the first surface of the semiconductor chip and is electrically connected to at least one conductive pad structure. At least one abut portion is disposed on the redistribution layer and electrically contacting thereto. A passivation layer covers the first surface of the semiconductor chip and surrounds the abut portion. A substrate is attached onto the second surface of the semiconductor chip. A fabrication method of the electronic device package is also disclosed. |
申请公布号 |
US8710680(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201113052769 |
申请日期 |
2011.03.21 |
申请人 |
CHANG SHU-MING;LOU BAI-YAO;WEN YING-NAN;LIU CHIEN-HUNG |
发明人 |
CHANG SHU-MING;LOU BAI-YAO;WEN YING-NAN;LIU CHIEN-HUNG |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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