发明名称 Method of manufacturing chemical mechanical polishing layers
摘要 A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
申请公布号 US8709114(B2) 申请公布日期 2014.04.29
申请号 US201213427383 申请日期 2012.03.22
申请人 CANTRELL BRIAN T.;MCHUGH KATHLEEN;MURNANE JAMES T.;MCCLAIN GEORGE H.;HUTT DURRON A.;BRADY ROBERT A.;YOUNG CHRISTOPHER A.;MILLER JEFFREY BORCHERDT;ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 发明人 CANTRELL BRIAN T.;MCHUGH KATHLEEN;MURNANE JAMES T.;MCCLAIN GEORGE H.;HUTT DURRON A.;BRADY ROBERT A.;YOUNG CHRISTOPHER A.;MILLER JEFFREY BORCHERDT
分类号 B24D3/00;B24D11/00;B24D18/00;C09K3/14 主分类号 B24D3/00
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