发明名称 |
Method of manufacturing chemical mechanical polishing layers |
摘要 |
A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized. |
申请公布号 |
US8709114(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201213427383 |
申请日期 |
2012.03.22 |
申请人 |
CANTRELL BRIAN T.;MCHUGH KATHLEEN;MURNANE JAMES T.;MCCLAIN GEORGE H.;HUTT DURRON A.;BRADY ROBERT A.;YOUNG CHRISTOPHER A.;MILLER JEFFREY BORCHERDT;ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
CANTRELL BRIAN T.;MCHUGH KATHLEEN;MURNANE JAMES T.;MCCLAIN GEORGE H.;HUTT DURRON A.;BRADY ROBERT A.;YOUNG CHRISTOPHER A.;MILLER JEFFREY BORCHERDT |
分类号 |
B24D3/00;B24D11/00;B24D18/00;C09K3/14 |
主分类号 |
B24D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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