发明名称 |
Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an integrated circuit above and to the substrate; mounting an internal interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate and over the integrated circuit with the integral-interposer-structure connected to the internal interconnect; and encapsulating the internal interconnect and the integrated circuit with an encapsulation. |
申请公布号 |
US8710634(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US20090410945 |
申请日期 |
2009.03.25 |
申请人 |
CHI HEEJO;CHUNG JAE HAN;MYUNG JUNWOO;PARK YEONGLM;LEE HYUNGMIN;STATS CHIPPAC LTD. |
发明人 |
CHI HEEJO;CHUNG JAE HAN;MYUNG JUNWOO;PARK YEONGLM;LEE HYUNGMIN |
分类号 |
H01L23/552;H01L21/44;H01L23/28 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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