发明名称 |
Method of inspecting wafer |
摘要 |
Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location. |
申请公布号 |
US8711348(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US201113115355 |
申请日期 |
2011.05.25 |
申请人 |
JANG HWAN-SEOK;KO JANG-MAN;SEONG JUN-SEOG;SHIN HO-BONG;LEE KIL-SU;LEE CHANG-HUN;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG HWAN-SEOK;KO JANG-MAN;SEONG JUN-SEOG;SHIN HO-BONG;LEE KIL-SU;LEE CHANG-HUN |
分类号 |
G01N21/00;G01N21/956 |
主分类号 |
G01N21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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