发明名称 Method of inspecting wafer
摘要 Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.
申请公布号 US8711348(B2) 申请公布日期 2014.04.29
申请号 US201113115355 申请日期 2011.05.25
申请人 JANG HWAN-SEOK;KO JANG-MAN;SEONG JUN-SEOG;SHIN HO-BONG;LEE KIL-SU;LEE CHANG-HUN;SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG HWAN-SEOK;KO JANG-MAN;SEONG JUN-SEOG;SHIN HO-BONG;LEE KIL-SU;LEE CHANG-HUN
分类号 G01N21/00;G01N21/956 主分类号 G01N21/00
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