| 发明名称 |
Bendable circuit board for LED mounting and interconnection |
| 摘要 |
This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection. |
| 申请公布号 |
US8707551(B2) |
申请公布日期 |
2014.04.29 |
| 申请号 |
US201313965778 |
申请日期 |
2013.08.13 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
AMEY DANIEL I.;GRAVELY DEBORAH R.;GREEN MICHAEL J.;WHITE STEVEN H. |
| 分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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