发明名称 Electronic component mounting apparatus
摘要 An electronic component mounting apparatus includes a head unit, component supply device, camera unit, and controller controlling the head unit and component supply device. The component supply device has a holder holding electronic component accommodating tapes, each having storage cells arranged in a row, the storage cells storing electronic components, and a feeder forwarding the electronic component accommodating tapes and moving the storage cells to a suction area where the electronic component can be suctioned by the nozzle. The camera unit is fixed to a head support, and captures an image of the suction area. The controller analyzes the image of the suction area obtained by the camera unit. When the controller determines that a portion of the electronic component accommodating tape in the suction area is a spliced portion based on a result of the analysis, the controller determines that the electronic component accommodating tape is changed.
申请公布号 US8707548(B2) 申请公布日期 2014.04.29
申请号 US201213477426 申请日期 2012.05.22
申请人 ABE TOMOTAKA;JUKI CORPORATION 发明人 ABE TOMOTAKA
分类号 B23P21/00 主分类号 B23P21/00
代理机构 代理人
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