发明名称 |
SPACER PARTICLE FOR RESIN COMPOSITION LAYER AND USE THEREOF |
摘要 |
<p>Spacer particles for a resin composition layer have a compressive strength at 10% compressive deformation at room temperature of 0.05 to 10 MPa or a compressive strength at room temperature of 0.01 to 2 N determined as a compressive load at 10% compressive deformation when the spacer particles are added into the resin composition layer so that a resin composition layer contains 48% by mass of the spacer particles, have a rate of change in compressive strength at 10% compressive deformation by a temperature change from room temperature to 50°C of 5% or less, a rate of change in compressive strength at 10% compressive deformation by a temperature change from -20°C to room temperature of 30% or less, or a rate of change in compressive strength by a temperature change from -50°C to 50°C of 15% or less determined as a compressive load at 10% compressive deformation, when the spacer particles are added into the resin composition layer so that a resin composition layer contains 48% by mass of the spacer particles, and have a volume average particle diameter of 2 to 200 µm and a coefficient of variation in particle diameter of 15% or less.</p> |
申请公布号 |
KR20140050726(A) |
申请公布日期 |
2014.04.29 |
申请号 |
KR20147006713 |
申请日期 |
2012.09.27 |
申请人 |
SEKISUI PLASTICS CO., LTD. |
发明人 |
HARADA RYOSUKE;TAKAHASHI TOMOYUKI;ISHIMORI FUMITAKA |
分类号 |
C08J3/12;B32B27/18;B32B27/30;C08F2/18;C08F20/18 |
主分类号 |
C08J3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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