| 摘要 |
<p>The epoxy organosilicon mixing resin composition is characterized in that it includes (A) an organic polysilsesquioxanes which includes at least two epoxy functional groups in one molecule, (B) an epoxy resin which includes at least two epoxy functional groups in one molecule, (C) a solidifying agent, and (D) a solidifying catalyst as the necessary components, and the solidifying catalyst contains at least one quaternary salt. The epoxy organosilicon mixing resin composition of the present invention protects the semiconductor component by the condensate, it can provides the semiconductor device with excellent reliability as there is no color changing in the second scotching experiment and there are many advantages in the industry. In this situation the condensate whose glass transition temperature is above 130 centigrade will not adhere by ash at all on the condensate surface, and the cracking-resistant property is excellent at the heat-resistance test.</p> |
