| 摘要 |
<p>A cut (76) which penetrates a resin layer (50) is formed in the resin layer (50) such that the cut (76) surrounds a third upper surface (68). A film (52) is formed such that the film (52) covers the whole resin layer (50) except for a bottom surface of the resin layer (50) inside the cut (76) and at least a portion of the resin layer (50) is exposed outside the cut (76). The resin layer (50) which is wholly covered with the film (52) is left inside the cut (76), and the whole resin layer (50) continuously formed with a surface exposed from the film (52) is removed outside the cut (76) . A bump (48) is formed by the resin layer (50) and the film (52) inside the cut (76), and a shutter (14) and at least a portion of a drive part (40) are formed by the film (52) outside the cut (76) in a state where these parts are floated from a first substrate (10).</p> |
