PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, PERMANENT RESIST AND METHOD FOR PRODUCING PERMANENT RESIST

摘要

The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same.