| 发明名称 |
FLEXIBLE PATTERN FORMING METHOD |
| 摘要 |
The present invention is a method for forming a circuit pattern on a substrate, and more specifically, to a method for forming a circuit pattern with an electroless plating process after the surface of the substrate is reformed by a plasma treatment. The present invention simply forms the circuit pattern with high conductivity. |
| 申请公布号 |
KR20140049782(A) |
申请公布日期 |
2014.04.28 |
| 申请号 |
KR20120116012 |
申请日期 |
2012.10.18 |
| 申请人 |
THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC);KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
HAN, JUN HYUN;PARK, SANG JIN;MOON, MYOUNG WOON |
| 分类号 |
H05K3/10;B41M5/00;H05K3/18 |
主分类号 |
H05K3/10 |
| 代理机构 |
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