发明名称 ELECTROPLATING APPARATUS WITH CONTACT RING DEPLATING
摘要 An electroplating apparatus has a rotor in a head, with a contact ring on the rotor. A lift/rotate actuator may move the head to position a sector of the contact ring into a deplate channel of a deplating station. Electrical current and a deplate liquid are applied directly onto the contacts of the contact ring, from a position radially inward of the contacts. Electrical current and a deplate liquid may also be separately applied onto the back side of the ring contact, from a position radially to the outside of the contact ring. A seal on the deplating station makes sliding contact with the contact ring as the contact ring rotates through the deplate channel, with the seal associated with an exhaust or vacuum opening that pulls deplating and rinse liquid through openings in the contact ring.
申请公布号 SG2013072681(A) 申请公布日期 2014.04.28
申请号 SG20130072681 申请日期 2013.09.26
申请人 APPLIED MATERIALS, INC. 发明人 RANDY A. HARRIS;BRYAN J. PUCH
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