| 摘要 |
<p>The board (14) has an electronic component (13) formed on a transferring surface of an electronic circuit (10) e.g. radio communication module, where transferring units are in mechanical and electrical connection between the mother board and the electronic circuit. A housing unit (16) is extended from a receiving face towards an opposite face to accommodate a part of the electronic component, where an electromagnetic shielding forms a cavity extended towards an outer side of the mother board. An independent claim is also included for a radio communication equipment.</p> |
