发明名称 RELEASE FILM
摘要 <p>The present invention addresses the problem of obtaining a heat-resistant release film which exhibits excellent release properties, particularly in being separated from an epoxy -resin-based adhesive, and which can dispense with the application of a silicone-based release agent. The present invention pertains to: a release film which contains (A) a polybutylene terephthalate, characterized in that the quantity of oligomers in the release film is 2500ppm or less; and a process for producing a printed circuit board, using the release film.</p>
申请公布号 WO2014061392(A1) 申请公布日期 2014.04.24
申请号 WO2013JP75248 申请日期 2013.09.19
申请人 MITSUI CHEMICALS TOHCELLO, INC. 发明人 MISHIRO, YUSUKE;SHIMA, KENJI;SHIMIZU, MASARU;TAGUCHI, EIICHI
分类号 C08J5/18;H05K3/00;H05K3/28 主分类号 C08J5/18
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