发明名称 DRY ETCHING APPARATUS AND METHOD OF DRY ETCHING USING THE SAME
摘要 The present invention relates to a dry etching device and a dry etching method using the same to secure a uniform removal rate for organic matters and pollutants from the surface of a substrate by maintaining the pressure of all sectors; and uniformly injecting a gas into an etching chamber for an etching process using a ring-shaped gas flow passage satisfying choke flow conditions and an adaptor ring comprising multiple orifices.
申请公布号 KR101389007(B1) 申请公布日期 2014.04.24
申请号 KR20120135107 申请日期 2012.11.27
申请人 AP SYSTEMS INC. 发明人 AN, JAE SHIN;LEE, JAE SEUNG;KIM, JUN HO;YOO, WUN JONG
分类号 H01L21/3065 主分类号 H01L21/3065
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