发明名称 |
DRY ETCHING APPARATUS AND METHOD OF DRY ETCHING USING THE SAME |
摘要 |
The present invention relates to a dry etching device and a dry etching method using the same to secure a uniform removal rate for organic matters and pollutants from the surface of a substrate by maintaining the pressure of all sectors; and uniformly injecting a gas into an etching chamber for an etching process using a ring-shaped gas flow passage satisfying choke flow conditions and an adaptor ring comprising multiple orifices. |
申请公布号 |
KR101389007(B1) |
申请公布日期 |
2014.04.24 |
申请号 |
KR20120135107 |
申请日期 |
2012.11.27 |
申请人 |
AP SYSTEMS INC. |
发明人 |
AN, JAE SHIN;LEE, JAE SEUNG;KIM, JUN HO;YOO, WUN JONG |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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