| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate including a ceramic substrate body and a heat dissipation via conductor of relative large diameter penetrating the substrate body, capable of dissipating heat generated from a mounted element generating a lot of heat, e.g., a light-emitting element mounted on the upper end face of the heat dissipation via conductor, efficiently to the outside from the back side of the substrate body, and having stabilized electrical conductivity.SOLUTION: A method of manufacturing a ceramic substrate 1 includes the steps of: preparing a molding S1 with a sheet material formed by laminating a plurality of green sheets G1-G3, in which at least one surface (back surface) 4 of a green sheet molding 2a becoming a substrate body 2 having a pair of surfaces 3, 4 is covered with a sheet material 20; forming via holes 12, 13 penetrating the molding S1 with a sheet material in the thickness direction thereof; filling the via holes 12, 13 with a conductor-containing paste 10a becoming a heat dissipation via conductor 10; and peeling the sheet material 20 after drying the conductor-containing paste 10a. |
