CIRCUIT CONNECTION MATERIAL, METHOD OF PRODUCING THE SAME AND METHOD OF PRODUCING PACKAGE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a circuit connection material having excellent adhesion, its production method and a method of producing a package by using it.SOLUTION: A package is produced by adhering an anisotropic conductive film containing particles of an anatase type active titanium oxide, a polymerizable resin, a polymerization initiator and conductive particles temporarily to an electrode of a first electronic part, arranging a second electronic part on the anisotropic conductive film and pressing the resultant body from the upper surface of the second electronic part with a pressure bonding head. In the temporary adhesion, the particles of the anatase type active titanium oxide exert super hydrophilicity, resulting in improved wettability and improved adhesion to a substrate.