METAL PARTICLE DISPERSION FOR CONDUCTIVE SUBSTRATE, AND MANUFACTURING METHOD FOR CONDUCTIVE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide metal particle dispersion for conductive substrate having excellent dispersibility and dispersion stability in which sedimentation of metal particle is suppressed.SOLUTION: A metal particle dispersion for conductive substrate contains metal particles, a dispersant, and a solvent, in which the dispersant has at least a constitutional unit represented by general formula (I), and at least a part of nitrogen site included in the constitutional unit and one kind or more selected from a group consisting of an acidic organic phosphorus compound, a sulfonic acid compound, and a halogenation hydro carbon form a salt as a polymeride. (Each sign in the general formula (I) is as described in the specification).