发明名称 |
SUBSTRATE WITH MULTIPLE ENCAPSULATED DEVICES |
摘要 |
A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer. |
申请公布号 |
WO2014062273(A2) |
申请公布日期 |
2014.04.24 |
申请号 |
WO2013US52974 |
申请日期 |
2013.07.31 |
申请人 |
ROBERT BOSCH GMBH;CHEN, PO-JUI;YAMA, GARY;LIGER, MATTHIEU;GRAHAM, ANDREW |
发明人 |
CHEN, PO-JUI;YAMA, GARY;LIGER, MATTHIEU;GRAHAM, ANDREW |
分类号 |
B81B7/02;B81C1/00 |
主分类号 |
B81B7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|