发明名称 SUBSTRATE WITH MULTIPLE ENCAPSULATED DEVICES
摘要 A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
申请公布号 WO2014062273(A2) 申请公布日期 2014.04.24
申请号 WO2013US52974 申请日期 2013.07.31
申请人 ROBERT BOSCH GMBH;CHEN, PO-JUI;YAMA, GARY;LIGER, MATTHIEU;GRAHAM, ANDREW 发明人 CHEN, PO-JUI;YAMA, GARY;LIGER, MATTHIEU;GRAHAM, ANDREW
分类号 B81B7/02;B81C1/00 主分类号 B81B7/02
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