| 摘要 |
A die measurement apparatus for measuring the height of a punch body and die is provided with a measurement instrument for measuring the distance from a preset punch reference position to the end surface of the punch body, or the distance from a preset die reference position to the end surface of the die. The punch reference position and the die reference position are separately set. By means of the die measurement apparatus, the punch body and die can be easily measured even when the size of the punch body and the size of the die differ greatly. |
