发明名称 |
POLISHING HEAD, POLISHING DEVICE, AND WORKPIECE POLISHING METHOD |
摘要 |
<p>A polishing head configured to hold a workpiece at the time of polishing the workpiece by bringing a front surface of the workpiece into sliding contact with a polishing pad attached to on a turn table, the polishing head includes: a workpiece-holding board configured to hold a back surface of the workpiece, the workpiece-holding board being flexible and being composed of ceramics; a sealed space defined on a surface of the workpiece-holding board on an opposite side of a surface on which the workpiece is held; and a pressure-controlling device configured to control a pressure in the sealed space, the polishing head being capable of adjusting a shape of the flexible workpiece-holding board into a convex shape or a concave shape by controlling a pressure in the sealed space by the pressure-controlling device.</p> |
申请公布号 |
KR20140048887(A) |
申请公布日期 |
2014.04.24 |
申请号 |
KR20137033820 |
申请日期 |
2012.05.28 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
MASUMURA HISASHI |
分类号 |
H01L21/304;B24B37/00;B24B37/30 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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