发明名称 GLASS WIRING PLATE
摘要 PROBLEM TO BE SOLVED: To provide a glass wiring plate capable of reducing conductor electric resistance and ablation.SOLUTION: A glass wiring plate includes: a glass substrate; a primer layer; a metal dispersion layer; and a copper plating layer. The primer layer, mainly composed of resin, is disposed on the glass substrate. The metal dispersion layer having a resin binder, and silver or copper dispersed in the resin binder, is disposed on the primer layer. The copper plating layer is disposed on an upper part or side part of the metal dispersion layer.
申请公布号 JP2014075543(A) 申请公布日期 2014.04.24
申请号 JP20120223451 申请日期 2012.10.05
申请人 TYCO ELECTRONICS JAPAN KK 发明人 FUKUDA KATSUNORI;TORIGOE AKIYOSHI
分类号 H05K3/18 主分类号 H05K3/18
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