ELECTRONIC COMPONENT, PROCESS FOR PRODUCING SAME, SEALING MATERIAL PASTE, AND FILLER PARTICLES

摘要

An electronic component equipped with two substrates, at least either of which is transparent, an organic member disposed therebetween, and a uniting part disposed along the peripheral parts of the two substrates, wherein the uniting part comprises a low-melting glass and filler particles, the low-melting glass containing vanadium oxide and the filler particles comprising a lowly heat-expandable material and an oxide including a divalent transition metal as a constituent element. The oxide has been dispersed in the lowly heat-expandable material, and the lowly heat-expandable material has a coefficient of thermal expansion in the temperature range 30-250ºC of 5×10-7 /ºC or less. Due to this, heating of the filler particles by irradiation with a laser is made possible and an electrical component having a highly reliable uniting part can be obtained.