发明名称 |
HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE |
摘要 |
A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator. |
申请公布号 |
US2014111944(A1) |
申请公布日期 |
2014.04.24 |
申请号 |
US201314059809 |
申请日期 |
2013.10.22 |
申请人 |
DENSO CORPORATION |
发明人 |
HARA YOSHIMICHI;YAMAMOTO TOSHIHISA;YAMANAKA TAKAHIRO;KAMEYAMA KOUJI;KOBAYASHI YUUJI |
分类号 |
H05K7/20;H05K3/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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