发明名称 THERMAL PLATE WITH OPTIONAL COOLING LOOP IN ELECTRONIC DISPLAY
摘要 Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal communication with the electronic display. A second portion of the thermal plate may be in thermal communication with the housing. Apertures may be placed within the plate and a fan may be positioned to draw air through the apertures. A gap may be located between the electronic display and a transparent plate assembly, where the fan may be further positioned to force air through the gap as well.
申请公布号 US2014111942(A1) 申请公布日期 2014.04.24
申请号 US201313954469 申请日期 2013.07.30
申请人 MANUFACTURING RESOURCES INTERNATIONAL, INC. 发明人 DUNN WILLIAM;LE DON;BEDELL WARE
分类号 H05K7/20;F28F3/00 主分类号 H05K7/20
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