发明名称 |
THERMAL PLATE WITH OPTIONAL COOLING LOOP IN ELECTRONIC DISPLAY |
摘要 |
Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal communication with the electronic display. A second portion of the thermal plate may be in thermal communication with the housing. Apertures may be placed within the plate and a fan may be positioned to draw air through the apertures. A gap may be located between the electronic display and a transparent plate assembly, where the fan may be further positioned to force air through the gap as well. |
申请公布号 |
US2014111942(A1) |
申请公布日期 |
2014.04.24 |
申请号 |
US201313954469 |
申请日期 |
2013.07.30 |
申请人 |
MANUFACTURING RESOURCES INTERNATIONAL, INC. |
发明人 |
DUNN WILLIAM;LE DON;BEDELL WARE |
分类号 |
H05K7/20;F28F3/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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