| 摘要 |
PURPOSE: A CMP additive and a CMP abrasive are provided to be able to increase the polishing selectivity of an oxide film to a nitride film while securing an excellent polishing speed with an action of an anionic surfactant and a cationic surfactant. CONSTITUTION: A CMP additive comprises a solvent, a cationic surfactant (2), and an anionic surfactant (1). The cationic surfactant and the anionic surfactant are bonded to a nitride film of the polishing surface to form a protective film. The bonding of the cationic surfactant is formed by the cationic surfactant bonded to the nitride film. The bonding of the anionic surfactant is formed by the anionic surfactant boned to the nitride film and the cationic surfactant bonded to the nitride film. A CMP abrasive includes ceria slurry and the CMP additive. |
