发明名称 CONTINUOUS PLATING TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a continuous plating treatment method capable of conducting plating treatment while changing a set current value for each workpiece.SOLUTION: When the number of the workpieces simultaneously transferrable in a plating tank in a completely immersed state is N, (N+1) cathode relay members that extend in a workpiece transfer direction and (N+1) power supply units are provided outside the plating tank, anode terminals of the respective power supply units are connected to the anode electrodes oppositely disposed inside the plating tank, and cathode terminals of the power supply units are respectively connected to the cathode relay members. A continuous plating treatment device is formed such that: power is supplied to each of the workpieces being transferred in the plating tank, from a corresponding power supply unit through a corresponding cathode relay member; and the power supply units are able to be controlled by constant current control when being transferred in a completely immersed state, and by current gradual increase control when being carried into the plating tank in a partially immersed state and by current gradual decrease control when being carried out from the plating tank in a partially immersed state.
申请公布号 JP2014074237(A) 申请公布日期 2014.04.24
申请号 JP20140002497 申请日期 2014.01.09
申请人 ALMEX PE INC 发明人 NODA TOMOHIRO;AKAMATSU KAZUTOSHI
分类号 C25D21/12;C25D7/00;C25D17/06;H05K3/18 主分类号 C25D21/12
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