| 摘要 |
Even when the strength of solder compositions that are similar to SnBi eutectic solder compositions has been improved, the brittle nature of these compositions means that when used in small electronic appliances such as portable appliances or laptop computers, if the small electronic appliance is dropped, the drop impact resistance is low, so the interface between the printed circuit board and solder surface is often debonded and destroyed. When soldering using a SnBi-based low-temperature solder paste, the present invention improves drop resistance characteristics by simultaneously supplying at least one preform selected from an Sn-Ag, an Sn-Cu, and an Sn-Ag-Cu solder composition in order to disperse the at least one solder composition selected from Sn-Ag, Sn-Cu, and Sn-Ag-Cu in the solder paste during SnBi-based low-temperature soldering. |
