| 摘要 |
A resin sealing sheet is cut into an adhesive sheet piece having an outer shape smaller than that of a wafer. The adhesive sheet piece is joined to a supporting adhesive tape together with a ring frame. The adhesive tape between the ring frame and the adhesive sheet piece is sandwiched by upper and lower housings to form a chamber. The wafer with a support board placed on a wafer holding table within the chamber faces to the adhesive sheet piece closely. The chamber is divided into two spaces by the adhesive tape. Differential pressure generated within the two spaces causes the adhesive tape and the adhesive sheet piece to cave and bend toward the wafer, whereby the adhesive sheet piece is joined to the wafer. |
