发明名称 THERMOELECTRIC MODULE, THERMOELECTRIC DEVICE COMPRISING THE SAME, AND PROCESS FOR PREPARING THE THERMOELECTRIC ELEMENT
摘要 A thermoelectric module including: an n-type thermoelectric element; a p-type thermoelectric element; a diffusion blocking layer bonded integrally on each of a top and a bottom surface of the n-type thermoelectric element and on each of a top and a bottom surface of the p-type thermoelectric element; an electrode on the n-type thermoelectric element and on the p-type thermoelectric element; and a bonding layer disposed between the electrode and at least one of the n-type thermoelectric element and the p-type thermoelectric element, wherein the bonding layer includes an amorphous metal.
申请公布号 US2014109948(A1) 申请公布日期 2014.04.24
申请号 US201313904365 申请日期 2013.05.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE KYU-HYOUNG;KIM SANG-IL;KIM SE-YUN;LEE EUN-SUNG
分类号 H01L35/08;H01L35/34 主分类号 H01L35/08
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