发明名称 |
THERMOELECTRIC MODULE, THERMOELECTRIC DEVICE COMPRISING THE SAME, AND PROCESS FOR PREPARING THE THERMOELECTRIC ELEMENT |
摘要 |
A thermoelectric module including: an n-type thermoelectric element; a p-type thermoelectric element; a diffusion blocking layer bonded integrally on each of a top and a bottom surface of the n-type thermoelectric element and on each of a top and a bottom surface of the p-type thermoelectric element; an electrode on the n-type thermoelectric element and on the p-type thermoelectric element; and a bonding layer disposed between the electrode and at least one of the n-type thermoelectric element and the p-type thermoelectric element, wherein the bonding layer includes an amorphous metal. |
申请公布号 |
US2014109948(A1) |
申请公布日期 |
2014.04.24 |
申请号 |
US201313904365 |
申请日期 |
2013.05.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE KYU-HYOUNG;KIM SANG-IL;KIM SE-YUN;LEE EUN-SUNG |
分类号 |
H01L35/08;H01L35/34 |
主分类号 |
H01L35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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