PRESSURE SENSING DEVICE AND CLIPPING APPARATUS USING THE SAME

摘要

A pressure sensing device and a clipping apparatus using the same are provided. The pressure sensing device includes a pressure sensing layer and a bump structure. The bump structure is disposed at one side of the pressure sensing layer. A parallel cross-sectional plane of the bump structure gradually becomes small along a direction. The parallel cross-sectional plane is substantially parallel to the pressure sensing layer.