The present invention relates to a test socket for a semiconductor package. The test socket for a semiconductor package according to an embodiment of the present invention includes a coupling protrusion which is inserted into a through hole formed on a DUT board and is formed on the bottom side of a base to fix a socket on which a semiconductor package is mounted on the DUT board.
申请公布号
KR101388247(B1)
申请公布日期
2014.04.24
申请号
KR20120115579
申请日期
2012.10.17
申请人
OKINS ELECTRONICS CO., LTD.
发明人
JUN, JIN GUK;PARK, SUNG KYU;SHIM, JAE WEON;JUN, MIN CHEOL