| 摘要 |
PROBLEM TO BE SOLVED: To improve throughput of a bonding device.SOLUTION: A substrate bonding apparatus overlaps and bonds a plurality of substrates, comprises: a pressure applying part for applying pressure, while heating, on a plurality of substrate holders for retaining the plurality of substrates; and a temperature control part for controlling distribution of heat of the substrate holders carried out from the pressure applying part and having released the retained substrates, so as to cause the distribution of the heat to be uniform at higher speed than in a case of leaving the substrate holders. A cooling medium of gas may be used by the temperature control part. A cooling chamber for cooling the substrate holder, which is carried out from the pressure applying part and retaining the substrate, may, further, be provided. A cooling medium of liquid may be used by the cooling chamber. |
