发明名称 |
PASSIVE COMPONENT AS THERMAL CAPACITANCE AND HEAT SINK |
摘要 |
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die. |
申请公布号 |
US2014110820(A1) |
申请公布日期 |
2014.04.24 |
申请号 |
US201213654447 |
申请日期 |
2012.10.18 |
申请人 |
INFINEON TECHNOLOGIES AUSTRIA AG |
发明人 |
STANDING MARTIN;PAOLUCCI MILKO |
分类号 |
H01L21/50;H01L27/06 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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