发明名称 |
Module and Coupling Arrangement |
摘要 |
The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement. |
申请公布号 |
US2014111292(A1) |
申请公布日期 |
2014.04.24 |
申请号 |
US201314142097 |
申请日期 |
2013.12.27 |
申请人 |
HUAWEI TECHNOLOGIES CO., LTD.;HUAWEI TECHONOLOGIES CO., LTD. |
发明人 |
MADEBERG BENGT;BERGSTEDT LEIF |
分类号 |
H01P3/08 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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