发明名称 |
METHOD FOR PRODUCING MATT COPPER DEPOSITS |
摘要 |
The present invention relates to a method for deposition of a matt copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfurcontaining additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matt appearance for decorative applications. |
申请公布号 |
WO2013110373(A3) |
申请公布日期 |
2014.04.24 |
申请号 |
WO2012EP73688 |
申请日期 |
2012.11.27 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
KRETSCHMER, STEFAN;HARTMANN, PHILIP;ROELFS, BERND |
分类号 |
C25D3/38;C25D5/10 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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