发明名称 SHEET BONDING APPARATUS AND SHEET BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sheet bonding apparatus capable of suppressing a reduction in the processing capability per unit time.SOLUTION: A sheet bonding device 1 comprises: supply means 2 to supply a belt-like original adhesive sheet AS0; pressing means 4 to bond the original adhesive sheet AS0 to an adherend WF by pressing; original adhesive sheet cutting means 5 to cut the original adhesive sheet AS0 in a prescribed shape; and collection means 7 to collect an un necessary sheet AS1 where an adhesive sheet AS is clipped from the original adhesive sheet AS0. The collection means 7 comprises: a plurality of winding means 70 (first and second winding means 70A and 70B) to wind the unnecessary sheet AS1; unnecessary sheet cutting means 77 to form a front end and a rear end on the unnecessary sheet AS1 by cutting the unnecessary sheet AS1 wound by one winding means 70 (first winding means 70A); and winding means 78 to wind the front end cut by the unnecessary sheet cutting means 77 onto the other winding means 70 (second winding means 70B).
申请公布号 JP2014075382(A) 申请公布日期 2014.04.24
申请号 JP20120220454 申请日期 2012.10.02
申请人 LINTEC CORP 发明人 YAMAGUCHI KAZUTOSHI
分类号 H01L21/683 主分类号 H01L21/683
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