发明名称 |
DEPOSITION METHOD AND DEPOSITION DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a deposition method which allows for production of an AlON film in which nitrogen is dispersed uniformly in the thickness direction even if the thickness is large.SOLUTION: After depositing an AIN film 23 on the SiC substrate 17 of a wafer W, deposition of an AIO film 24 and deposition of an AIN film 23 on the AIO film 24 thus deposited are repeated, to form an AION film 25 having a lamination structure where the AIO film 24 and the AIN film 23 are laminated alternately, and then the AION film 25 is heat treated. |
申请公布号 |
JP2014075451(A) |
申请公布日期 |
2014.04.24 |
申请号 |
JP20120221662 |
申请日期 |
2012.10.03 |
申请人 |
TOKYO ELECTRON LTD;OSAKA UNIV |
发明人 |
SHINONOME SHUJI;KASHIWAGI YUSAKU;MOROZUMI YUICHIRO;KAZUMURA TAMOTSU;HARADA TAKESHIGE;TAKAHASHI HIROSUKE;WATABE HEIJI;SHIMURA TAKAYOSHI;HOSOI TAKUJI |
分类号 |
H01L21/318;H01L21/28;H01L21/31;H01L21/316;H01L21/336;H01L29/12;H01L29/423;H01L29/47;H01L29/49;H01L29/78;H01L29/872 |
主分类号 |
H01L21/318 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|