| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem of a CMP device for polishing the semiconductor wafer surface chemically and mechanically that supply of cleaning water, i.e., pure water, to a cleaning pad is not stabilized.SOLUTION: A flowmeter is attached to a polishing pad cleaning water supply line, flow rate of the cleaning water flowing through the line is monitored, and an alarm is issued when the flow rare is abnormal. Since a polishing pad is always cleaned with cleaning water of an appropriate flow rate, abnormal polishing of a semiconductor wafer due to insufficient cleaning of the polishing pad can be eliminated. Furthermore, a CMP device failure, such as a valve failure, can be found and told to an operator reliably. |
