发明名称 |
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which easily and surely keep electrical connection between an interstitial via hole and a first conductive pattern on a surface side.SOLUTION: A printed wiring board comprises: a substrate having an insulation property; a first conductive pattern stacked on a surface of the substrate; a second conductive pattern stacked on a rear surface of the substrate; and an interstitial via hole passing through the first conductive pattern and the substrate. A cross-sectional shape of the interstitial via hole having a surface of the conductive pattern as a cut surface, is non-circular. It is preferred that the printed wiring board has a plurality of interstitial via holes, and cross-sectional shapes of a plurality of interstitial via holes have long axes along approximate same directions. The cross-sectional shapes may be nearly a polygonal shape or an elliptic face. |
申请公布号 |
JP2014075457(A) |
申请公布日期 |
2014.04.24 |
申请号 |
JP20120221727 |
申请日期 |
2012.10.03 |
申请人 |
SUMITOMO ELECTRIC PRINTED CIRCUIT INC;SUMITOMO ELECTRIC IND LTD |
发明人 |
UCHIDA YOSHIFUMI;OKA YOSHIO;KASUGA TAKASHI |
分类号 |
H05K1/11;H05K1/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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