发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board which easily and surely keep electrical connection between an interstitial via hole and a first conductive pattern on a surface side.SOLUTION: A printed wiring board comprises: a substrate having an insulation property; a first conductive pattern stacked on a surface of the substrate; a second conductive pattern stacked on a rear surface of the substrate; and an interstitial via hole passing through the first conductive pattern and the substrate. A cross-sectional shape of the interstitial via hole having a surface of the conductive pattern as a cut surface, is non-circular. It is preferred that the printed wiring board has a plurality of interstitial via holes, and cross-sectional shapes of a plurality of interstitial via holes have long axes along approximate same directions. The cross-sectional shapes may be nearly a polygonal shape or an elliptic face.
申请公布号 JP2014075457(A) 申请公布日期 2014.04.24
申请号 JP20120221727 申请日期 2012.10.03
申请人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC;SUMITOMO ELECTRIC IND LTD 发明人 UCHIDA YOSHIFUMI;OKA YOSHIO;KASUGA TAKASHI
分类号 H05K1/11;H05K1/02 主分类号 H05K1/11
代理机构 代理人
主权项
地址