发明名称 FILM FORMATION DEVICE, AND FILM FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film formation device that can form a film on a substrate, or to provide a film formation method that can form a film on the substrate.SOLUTION: A film formation device comprises: a supporting member supporting a substrate; and a plurality of nozzles provided so as to be adjacent to the supporting member and so as to be separated from each other. In addition, the plurality of nozzles blow out a vaporized material to form a part where the material is deposited and a part where no material is deposited.
申请公布号 JP2014075301(A) 申请公布日期 2014.04.24
申请号 JP20120223051 申请日期 2012.10.05
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 TANAKA KOICHIRO;YANAGAWA KATSUYOSHI
分类号 H05B33/10;C23C14/24;H01L51/50;H05B33/02 主分类号 H05B33/10
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