发明名称 PRODUCTION METHOD OF RESIN STRUCTURE FOR MICROSTRUCTURE, AND PRODUCTION METHOD OF MICROSTRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a production method of a resin structure for a microstructure and a production method of a microstructure in which a high accuracy microstructure can be formed, and that can form a sacrifice film pattern in which image dissection is high, sensitivity is high, and heat resistance is high.SOLUTION: A production method of a resin structure for a microstructure includes: (A) a step in which a composition for light pattern formation property film formation that includes (1) a high molecular compound, (2) an optical acid generator, and (3) an organic solvent is used, and is applied to a base plate as a light pattern formation property sacrifice film having a film thickness of 1-30 μm; (B) a step in which the base plate on which the composition is applied is heated; (C) a step in which the sacrifice film is irradiated along a pattern layout image with a first high energy ray; (D) a step in which a sacrifice film pattern is formed by image development by an alkaline developer; (E) a step in which the obtained sacrifice film pattern is irradiated with ultraviolet light as a second high energy ray; and (F) a step in which the base plate is heated at 100-250°C, wherein an irradiation amount of the first high energy ray in the (C) step is at most 250 mJ/cm, and a side wall angle measure of the base plate and the sacrifice film after the (F) step is held to be at least 80° and at most 90°.A pattern of a microstructure can be formed by high sensitivity, and a sacrifice pattern in which heat resistance is high can be produced by a production method of the present invention.
申请公布号 JP2014074893(A) 申请公布日期 2014.04.24
申请号 JP20130163780 申请日期 2013.08.07
申请人 SHIN ETSU CHEM CO LTD 发明人 HIRANO SADANORI;IIO TADASHI;YANAGISAWA HIDEYOSHI
分类号 G03F7/40;C08F12/22;C08K5/17;C08K5/36;C08K5/42;C08L25/18;G03F7/004;G03F7/039;H01L21/027 主分类号 G03F7/40
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