ELECTROLYTIC COPPER PLATING SOLUTION, AND METHOD OF ELECTROLYTIC COPPER PLATING

摘要

PROBLEM TO BE SOLVED: To provide an electrolytic copper plating solution excellent in via filling ability without using formaldehyde which is harmful to the environment.SOLUTION: The electrolytic copper plating solution contains compounds which have a -X-S-Y- structure where X and Y are individually atoms selected from the group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and specific urea derivatives. Good filled vias can be made without causing worsening of the exterior appearance of plating using this electrolytic copper plating solution.