发明名称 COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a component mounting apparatus which can increase productivity by reducing the takt time regarding a mounting head.SOLUTION: A mounting head 10 of a component mounting apparatus has a rotation axis 11 substantially parallel to a surface of a substrate S, and at least one component holding unit 13 attached radially to the rotation axis 11 in radial directions. In a process of rotation about the rotation axis 11, the component holding unit 13 receives a component P from a component supply part 30 and mounts the component on the surface of the substrate S.
申请公布号 JP2014075531(A) 申请公布日期 2014.04.24
申请号 JP20120223242 申请日期 2012.10.05
申请人 SAMSUNG TECHWIN CO LTD 发明人 KOIKE KOSHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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