| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive element having a support film, in which flaws generating in the support film can be sufficiently suppressed, and to provide a method for forming a resist pattern and a method for manufacturing a printed wiring board using the photosensitive element.SOLUTION: The photosensitive element includes a support film 10 and a layer 20 made of a photosensitive resin composition formed on the support film 10; and the photosensitive element further includes a self-healing layer or a hard coat layer on a surface of the supporting film 10 not in contact with the layer 20 made of the photosensitive resin composition. The layer made of the photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator. |
