发明名称 SEALING SHEET COATED SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a sealing sheet coated semiconductor element in which generation of voids in the sealing sheet is suppressed, and to provide a manufacturing method therefor, a semiconductor device including the sealing sheet coated semiconductor element and having excellent reliability, and a manufacturing method therefor.SOLUTION: A phosphor layer coated LED 10 includes an LED 4 having a back surface 22 in contact with a substrate 9, and a front surface 23 arranged on the other side in a front-back direction (front surface side) of the back surface 22, and a phosphor sheet 5 covering at least the front surface 23 of the LED 4. When projected from one side in the front-back direction to the other side, the phosphor sheet 5 includes an exposed surface 27 which is not included in the back surface 22 of the LED 4 but exposed from the back surface 22. The exposed surface 27 is a portion on the other side (front surface portion) located on the other side in the front-back direction (front surface side) of the back surface 22 of the LED 4.
申请公布号 JP2014075450(A) 申请公布日期 2014.04.24
申请号 JP20120221656 申请日期 2012.10.03
申请人 NITTO DENKO CORP 发明人 KATAYAMA HIROYUKI;KONDO TAKASHI;EBE YUKI;MITANI MUNEHISA
分类号 H01L33/50 主分类号 H01L33/50
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