| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP polishing liquid for palladium polishing which improves polishing speed of a palladium layer and can polish at a stable polishing speed even if plural palladium layers are polished successively.SOLUTION: A CMP polishing liquid for palladium polishing contains organic solvent, amino acid, 1,2,4-triazole, phosphoric acids, oxidizer, and abrasive grains. The CMP polishing liquid contains at least one kind chosen among glycol, glycol derivative, and alcohol as the organic solvent. Solid precipitation amounts generating in a solution that 5 mg of palladium acetate is dissolved in a mixture of 2.5 g of the organic solvent, 0.05 g of the amino acid, and 2 g of water, and left on one day, is not more than 0.1 mg. |
